Total
172 CVE
| CVE | Vendors | Products | Updated | CVSS v2 | CVSS v3 |
|---|---|---|---|---|---|
| CVE-2018-11853 | 1 Qualcomm | 46 Ipq8074, Ipq8074 Firmware, Mdm9206 and 43 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| Lack of check on out of range for channels When processing channel list set command will lead to buffer flow in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016 | |||||
| CVE-2018-11866 | 1 Qualcomm | 50 Ipq8074, Ipq8074 Firmware, Mdm9206 and 47 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| Integer overflow may happen in WLAN when calculating an internal structure size due to lack of validation of the input length in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18310 | 1 Qualcomm | 62 Msm8909w, Msm8909w Firmware, Msm8996au and 59 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| ClientEnv exposes services 0-32 to HLOS in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SD 845, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016 | |||||
| CVE-2017-18141 | 1 Qualcomm | 68 Ipq8074, Ipq8074 Firmware, Mdm9206 and 65 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| When a 3rd party TEE has been loaded it is possible for the non-secure world to create a secure monitor call which will give it access to privileged functions meant to only be accessible from the TEE in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18320 | 1 Qualcomm | 64 Msm8996au, Msm8996au Firmware, Sd 410 and 61 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| QSEE unload attempt on a 3rd party TEE without previously loading results in a data abort in snapdragon automobile and snapdragon mobile in versions MSM8996AU, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2018-11279 | 1 Qualcomm | 92 Mdm9206, Mdm9206 Firmware, Mdm9607 and 89 more | 2024-02-04 | 8.3 HIGH | 8.8 HIGH |
| Lack of check of input size can make device memory get corrupted because of buffer overflow in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 810, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX20, Snapdragon_High_Med_2016, SXR1130 | |||||
| CVE-2018-5867 | 1 Qualcomm | 76 Mdm9206, Mdm9206 Firmware, Mdm9607 and 73 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| Lack of checking input size can lead to buffer overflow In WideVine in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016, SXR1130 | |||||
| CVE-2018-13888 | 1 Qualcomm | 64 Mdm9206, Mdm9206 Firmware, Mdm9607 and 61 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| There is potential for memory corruption in the RIL daemon due to de reference of memory outside the allocated array length in RIL in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in versions MDM9206, MDM9607, MDM9635M, MDM9650, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820A, SD 835, SD 845 / SD 850, SD 855, SDM439, SDM630, SDM660, ZZ_QCS605. | |||||
| CVE-2017-18172 | 1 Qualcomm | 48 Mdm9635m, Mdm9635m Firmware, Sd 400 and 45 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2018-11871 | 1 Qualcomm | 98 Ipq4019, Ipq4019 Firmware, Ipq8064 and 95 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| Buffer overwrite can happen in WLAN function while processing set pdev parameter command due to lack of input validation in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version IPQ4019, IPQ8064, IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MSM8996AU, QCA6174A, QCA6564, QCA6574, QCA6574AU, QCA6584, QCA6584AU, QCA9377, QCA9378, QCA9379, QCA9531, QCA9558, QCA9563, QCA9880, QCA9886, QCA9980, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM630, SDM632, SDM636, SDM660, SDM710, SDX20, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18322 | 1 Qualcomm | 62 Mdm9206, Mdm9206 Firmware, Mdm9607 and 59 more | 2024-02-04 | 2.1 LOW | 5.5 MEDIUM |
| Cryptographic key material leaked in WCDMA debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18311 | 1 Qualcomm | 70 Mdm9607, Mdm9607 Firmware, Mdm9635m and 67 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| XPU Master privilege escalation is possible due to improper access control of unused configuration xPU ports where unused configuration ports are open in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016. | |||||
| CVE-2018-11845 | 1 Qualcomm | 80 Mdm9150, Mdm9150 Firmware, Mdm9206 and 77 more | 2024-02-04 | 4.9 MEDIUM | 5.5 MEDIUM |
| Usage of non-time-constant comparison functions can lead to information leakage through side channel analysis in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music in versions MDM9150, MDM9206, MDM9607, MDM9650, MDM9655, MSM8996AU, QCS605, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 625, SD 632, SD 636, SD 650/52, SD 675, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SD 8CX, SDA660, SDM439, SDM630, SDM660, Snapdragon_High_Med_2016, SXR1130. | |||||
| CVE-2017-8276 | 1 Qualcomm | 66 Mdm9206, Mdm9206 Firmware, Mdm9607 and 63 more | 2024-02-04 | 4.6 MEDIUM | 7.8 HIGH |
| Improper authorization involving a fuse in TrustZone in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18319 | 1 Qualcomm | 60 Mdm9206, Mdm9206 Firmware, Mdm9607 and 57 more | 2024-02-04 | 2.1 LOW | 5.5 MEDIUM |
| Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016. | |||||
| CVE-2017-18330 | 1 Qualcomm | 78 Ipq8074, Ipq8074 Firmware, Mdm9206 and 75 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| Buffer overflow in AES-CCM and AES-GCM encryption via initialization vector in snapdragon automobile, snapdragon mobile and snapdragon wear in versions IPQ8074, MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 439 / SD 429, SD 450, SD 615/16/SD 415, SD 625, SD 632, SD 636, SD 650/52, SD 810, SD 820, SD 820A, SD 835, SDA660, SDM439, SDM630, SDM660, SDX24, Snapdragon_High_Med_2016. | |||||
| CVE-2016-10458 | 1 Qualcomm | 50 Sd 205, Sd 205 Firmware, Sd 210 and 47 more | 2024-02-04 | 10.0 HIGH | 9.8 CRITICAL |
| In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, SDX20, and Snapdragon_High_Med_2016, the 'proper' solution for this will be to ensure that any users of qsee_log in the bootchain (before Linux boots) unallocate their buffers and clear the qsee_log pointer. Until support for that is implemented in TZ and the bootloader, enable tz_log to avoid potential scribbling. This solution will prevent the linux kernel memory corruption. | |||||
| CVE-2018-5892 | 1 Qualcomm | 54 Mdm9206, Mdm9206 Firmware, Mdm9607 and 51 more | 2024-02-04 | 5.0 MEDIUM | 7.5 HIGH |
| The Touch Pal application can collect user behavior data without awareness by the user in Snapdragon Mobile and Snapdragon Wear. | |||||
| CVE-2015-9218 | 1 Qualcomm | 48 Msm8909w, Msm8909w Firmware, Sd 205 and 45 more | 2024-02-04 | 4.9 MEDIUM | 5.5 MEDIUM |
| In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, when processing bad HEVC clips, the DPB fills, and with no error handling for DPB being full, a hang occurs. | |||||
| CVE-2015-9217 | 1 Qualcomm | 48 Msm8909w, Msm8909w Firmware, Sd 205 and 45 more | 2024-02-04 | 7.2 HIGH | 7.8 HIGH |
| In Android before 2018-04-05 or earlier security patch level on Qualcomm Snapdragon Mobile and Snapdragon Wear MSM8909W, SD 210/SD 212/SD 205, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 800, SD 808, SD 810, SD 820, SD 835, SD 845, SDM630, SDM636, SDM660, and Snapdragon_High_Med_2016, certain malformed HVEC clips could cause an assertion to fail. | |||||