CVE-2022-33292

{"id": "CVE-2022-33292", "metrics": {"cvssMetricV31": [{"type": "Secondary", "source": "product-security@qualcomm.com", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 7.8, "attackVector": "LOCAL", "baseSeverity": "HIGH", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "LOW", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}, {"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 7.8, "attackVector": "LOCAL", "baseSeverity": "HIGH", "vectorString": "CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "LOW", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}]}, "published": "2023-05-02T06:15:09.757", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin", "tags": ["Patch", "Vendor Advisory"], "source": "product-security@qualcomm.com"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins/may-2023-bulletin", "tags": ["Patch", "Vendor Advisory"], "source": "af854a3a-2127-422b-91ae-364da2661108"}], "vulnStatus": "Modified", "weaknesses": [{"type": "Secondary", "source": "product-security@qualcomm.com", "description": [{"lang": "en", "value": "CWE-416"}]}, {"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-416"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption in Qualcomm IPC due to use after free while receiving the incoming packet and reposting it."}], "lastModified": "2024-11-21T07:08:05.440", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:sg4150p_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, 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