CVE-2022-22081

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"2022-09-16T06:15:09.807", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins/september-2022-bulletin", "tags": ["Vendor Advisory"], "source": "af854a3a-2127-422b-91ae-364da2661108"}], "vulnStatus": "Modified", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-190"}]}], "descriptions": [{"lang": "en", "value": "Memory corruption in audio module due to integer overflow in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables"}, {"lang": "es", "value": "Una corrupci\u00f3n de memoria en el m\u00f3dulo de audio debido a un desbordamiento de enteros en Snapdragon Auto, Snapdragon Connectivity, Snapdragon Mobile, Snapdragon Wearables"}], "lastModified": "2024-11-21T06:46:06.357", "configurations": [{"nodes": 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