CVE-2021-42114

Modern DRAM devices (PC-DDR4, LPDDR4X) are affected by a vulnerability in their internal Target Row Refresh (TRR) mitigation against Rowhammer attacks. Novel non-uniform Rowhammer access patterns, consisting of aggressors with different frequencies, phases, and amplitudes allow triggering bit flips on affected memory modules using our Blacksmith fuzzer. The patterns generated by Blacksmith were able to trigger bitflips on all 40 PC-DDR4 DRAM devices in our test pool, which cover the three major DRAM manufacturers: Samsung, SK Hynix, and Micron. This means that, even when chips advertised as Rowhammer-free are used, attackers may still be able to exploit Rowhammer. For example, this enables privilege-escalation attacks against the kernel or binaries such as the sudo binary, and also triggering bit flips in RSA-2048 keys (e.g., SSH keys) to gain cross-tenant virtual-machine access. We can confirm that DRAM devices acquired in July 2020 with DRAM chips from all three major DRAM vendors (Samsung, SK Hynix, Micron) are affected by this vulnerability. For more details, please refer to our publication.
References
Link Resource
https://comsec.ethz.ch/research/dram/blacksmith/ Exploit Third Party Advisory
https://comsec.ethz.ch/wp-content/files/blacksmith_sp22.pdf Exploit Third Party Advisory
https://github.com/comsec-group/blacksmith Exploit Third Party Advisory
Configurations

Configuration 1 (hide)

AND
cpe:2.3:o:samsung:ddr4_sdram_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:samsung:ddr4_sdram:-:*:*:*:*:*:*:*

Configuration 2 (hide)

AND
cpe:2.3:o:samsung:lddr4_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:samsung:lddr4:-:*:*:*:*:*:*:*

Configuration 3 (hide)

AND
cpe:2.3:o:micron:lddr4_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:micron:lddr4:-:*:*:*:*:*:*:*

Configuration 4 (hide)

AND
cpe:2.3:o:micron:ddr4_sdram_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:micron:ddr4_sdram:-:*:*:*:*:*:*:*

Configuration 5 (hide)

AND
cpe:2.3:o:skhynix:ddr4_sdram_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:skhynix:ddr4_sdram:-:*:*:*:*:*:*:*

Configuration 6 (hide)

AND
cpe:2.3:o:skhynix:lddr4_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:skhynix:lddr4:-:*:*:*:*:*:*:*

History

29 Nov 2021, 18:45

Type Values Removed Values Added
CVSS v2 : 10.0
v3 : 10.0
v2 : 7.9
v3 : 8.3

18 Nov 2021, 16:37

Type Values Removed Values Added
CWE NVD-CWE-Other
CVSS v2 : unknown
v3 : unknown
v2 : 10.0
v3 : 10.0
CPE cpe:2.3:o:micron:ddr4_sdram_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:skhynix:lddr4_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:samsung:ddr4_sdram_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:samsung:lddr4_firmware:-:*:*:*:*:*:*:*
cpe:2.3:h:micron:ddr4_sdram:-:*:*:*:*:*:*:*
cpe:2.3:h:skhynix:ddr4_sdram:-:*:*:*:*:*:*:*
cpe:2.3:h:samsung:lddr4:-:*:*:*:*:*:*:*
cpe:2.3:h:micron:lddr4:-:*:*:*:*:*:*:*
cpe:2.3:h:samsung:ddr4_sdram:-:*:*:*:*:*:*:*
cpe:2.3:h:skhynix:lddr4:-:*:*:*:*:*:*:*
cpe:2.3:o:skhynix:ddr4_sdram_firmware:-:*:*:*:*:*:*:*
cpe:2.3:o:micron:lddr4_firmware:-:*:*:*:*:*:*:*
References (CONFIRM) https://comsec.ethz.ch/wp-content/files/blacksmith_sp22.pdf - (CONFIRM) https://comsec.ethz.ch/wp-content/files/blacksmith_sp22.pdf - Exploit, Third Party Advisory
References (MISC) https://comsec.ethz.ch/research/dram/blacksmith/ - (MISC) https://comsec.ethz.ch/research/dram/blacksmith/ - Exploit, Third Party Advisory
References (MISC) https://github.com/comsec-group/blacksmith - (MISC) https://github.com/comsec-group/blacksmith - Exploit, Third Party Advisory

16 Nov 2021, 13:15

Type Values Removed Values Added
New CVE

Information

Published : 2021-11-16 12:15

Updated : 2024-02-04 22:08


NVD link : CVE-2021-42114

Mitre link : CVE-2021-42114

CVE.ORG link : CVE-2021-42114


JSON object : View

Products Affected

skhynix

  • lddr4_firmware
  • lddr4
  • ddr4_sdram_firmware
  • ddr4_sdram

micron

  • lddr4
  • ddr4_sdram_firmware
  • ddr4_sdram
  • lddr4_firmware

samsung

  • ddr4_sdram_firmware
  • ddr4_sdram
  • lddr4
  • lddr4_firmware
CWE
NVD-CWE-Other CWE-20

Improper Input Validation