{"id": "CVE-2019-2242", "metrics": {"cvssMetricV2": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"version": "2.0", "baseScore": 10.0, "accessVector": "NETWORK", "vectorString": "AV:N/AC:L/Au:N/C:C/I:C/A:C", "authentication": "NONE", "integrityImpact": "COMPLETE", "accessComplexity": "LOW", "availabilityImpact": "COMPLETE", "confidentialityImpact": "COMPLETE"}, "acInsufInfo": false, "impactScore": 10.0, "baseSeverity": "HIGH", "obtainAllPrivilege": false, "exploitabilityScore": 10.0, "obtainUserPrivilege": false, "obtainOtherPrivilege": false, "userInteractionRequired": false}], "cvssMetricV31": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 9.8, "attackVector": "NETWORK", "baseSeverity": "CRITICAL", "vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "NONE", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 3.9}]}, "published": "2019-12-18T06:15:12.940", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/december-2019-bulletin", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-190"}]}], "descriptions": [{"lang": "en", "value": "Device memory may get corrupted because of buffer overflow/underflow. in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables in APQ8009, APQ8016, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SM6150, SM7150, SXR1130"}, {"lang": "es", "value": "La memoria del dispositivo puede corromperse debido al desbordamiento y subdesbordamiento del b\u00fafer. En los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon IoT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables en las versiones APQ8009, APQ8016, APQ8017, APQ8053, APQ8096, APQ8096AU, APQ8098, MDM9150, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8905, MSM8909, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8939, MSM8940, MSM8953, MSM8996AU, MSM8998, Nicobar, QCM2150, QCS605, QM215, SDA660, SDA845, SDM429, SDM439, SDM450, SDM630, SDM632, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SDX20, SM6150, SM7150, SXR1130."}], "lastModified": "2019-12-19T20:45:21.383", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:apq8009_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "C61BF93F-53DF-4399-AF41-45CEC1E0A2B8"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": 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