{"id": "CVE-2019-14112", "metrics": {"cvssMetricV2": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"version": "2.0", "baseScore": 10.0, "accessVector": "NETWORK", "vectorString": "AV:N/AC:L/Au:N/C:C/I:C/A:C", "authentication": "NONE", "integrityImpact": "COMPLETE", "accessComplexity": "LOW", "availabilityImpact": "COMPLETE", "confidentialityImpact": "COMPLETE"}, "acInsufInfo": false, "impactScore": 10.0, "baseSeverity": "HIGH", "obtainAllPrivilege": false, "exploitabilityScore": 10.0, "obtainUserPrivilege": false, "obtainOtherPrivilege": false, "userInteractionRequired": false}], "cvssMetricV31": [{"type": "Primary", "source": "nvd@nist.gov", "cvssData": {"scope": "UNCHANGED", "version": "3.1", "baseScore": 9.8, "attackVector": "NETWORK", "baseSeverity": "CRITICAL", "vectorString": "CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H", "integrityImpact": "HIGH", "userInteraction": "NONE", "attackComplexity": "LOW", "availabilityImpact": "HIGH", "privilegesRequired": "NONE", "confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 3.9}]}, "published": "2020-04-16T11:15:15.120", "references": [{"url": "https://www.qualcomm.com/company/product-security/bulletins/april-2020-bulletin", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-120"}]}], "descriptions": [{"lang": "en", "value": "Potential buffer overflow while processing CBF frames due to lack of check of buffer length before copy in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking in APQ8098, IPQ6018, IPQ8074, MSM8998, Nicobar, QCA8081, QCN7605, QCS404, QCS605, Rennell, SC7180, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130"}, {"lang": "es", "value": "Un potencial desbordamiento del b\u00fafer mientras se procesa trama CBF debido a una falta de comprobaci\u00f3n de longitud del b\u00fafer antes de la copia en los productos Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wired Infrastructure and Networking en versiones APQ8098, IPQ6018, IPQ8074, MSM8998, Nicobar, QCA8081, QCN7605, QCS404, QCS605, Rennell, SC7180, SC8180X, SDA660, SDA845, SDM630, SDM636, SDM660, SDM670, SDM710, SDM845, SDM850, SM6150, SM7150, SM8150, SXR1130, SXR2130."}], "lastModified": "2020-04-22T13:19:15.050", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:apq8098_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "13A7328A-89FB-4E9C-B4E3-D8097443FB7A"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": 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