CVE-2017-18295

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"confidentialityImpact": "HIGH"}, "impactScore": 5.9, "exploitabilityScore": 1.8}]}, "published": "2018-10-23T13:29:01.523", "references": [{"url": "http://www.securitytracker.com/id/1041432", "tags": ["Third Party Advisory", "VDB Entry"], "source": "product-security@qualcomm.com"}, {"url": "https://source.android.com/security/bulletin/2018-08-01#qualcomm-closed-source-components", "tags": ["Third Party Advisory"], "source": "product-security@qualcomm.com"}, {"url": "https://www.qualcomm.com/company/product-security/bulletins", "tags": ["Vendor Advisory"], "source": "product-security@qualcomm.com"}], "vulnStatus": "Analyzed", "weaknesses": [{"type": "Primary", "source": "nvd@nist.gov", "description": [{"lang": "en", "value": "CWE-119"}]}], "descriptions": [{"lang": "en", "value": "Possible buffer overflow if input is not null terminated in DSP Service module in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDX20."}, {"lang": "es", "value": "Posible desbordamiento de b\u00fafer si la entrada no est\u00e1 acabada en null en el m\u00f3dulo del servicio DSP en Snapdragon Automobile, Snapdragon Mobile y Snapdragon Wear en la versi\u00f3n MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835 y SDX20."}], "lastModified": "2018-12-06T17:20:35.927", "configurations": [{"nodes": [{"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:o:qualcomm:mdm9206_firmware:-:*:*:*:*:*:*:*", "vulnerable": true, "matchCriteriaId": "A960B86A-C397-4ACB-AEE6-55F316D32949"}], "operator": "OR"}, {"negate": false, "cpeMatch": [{"criteria": "cpe:2.3:h:qualcomm:mdm9206:-:*:*:*:*:*:*:*", "vulnerable": false, "matchCriteriaId": "D79B8959-3D1E-4B48-9181-D75FE90AAF98"}], "operator": "OR"}], "operator": "AND"}, {"nodes": [{"negate": false, "cpeMatch": 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